Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With provision for cooling the housing or its contents
Patent
1995-10-17
1997-12-02
Thomas, Tom
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
With provision for cooling the housing or its contents
257722, 361703, 361719, 165 803, H01L 2334, H05K 720
Patent
active
056939817
ABSTRACT:
Method of cooling electronic systems and semiconductor devices as well as an electronic system and a semiconductor device with heat dissipating elements. The method includes the steps of providing an electronic system or a semiconductor device with a heat sink including at least a first element having a generally flat shape with a shoulder projecting from one generally flat surface, and configured to thermally engage similar elements. In one embodiment, a first and a second heat sink element are provided, with one of the first and second elements having a protrusion and the other of the first and second elements defining a depression configured to receive and retain said protrusion. Alternatively, the first and second elements may be bonded together with a thermally conductive adhesive.
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patent: 5175612 (1992-12-01), Long et al.
patent: 5227663 (1993-07-01), Patil et al.
patent: 5293930 (1994-03-01), Pitasi
Joroski Joseph
Schneider Mark R.
LSI Logic Corporation
Ostrowski David
Thomas Tom
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