Electronic substrate article and method of preparation

Details Electronic substrate article and method of preparation Electronic substrate article and method of preparation

1984-07-30

1988-05-17

Capella, Steven

Electricity: conductors and insulators

Feedthrough or bushing

Compression

174137B, 501127, H01L 3902

Patent

active

047454571

ABSTRACT:
An electronic substrate is provided in the form of a sintered body of polycrystalline alumina ceramic which further contains up to approximately 4% glass forming oxide selected from SiO.sub.2, MgO and ZrO.sub.2 along with about 0.4-2.0% refractory metal oxide to substantially reduce visible transmission in said substrate. In a preferred embodiment, said substrate comprises an elongated member of the ceramic material such as a flat layer which further includes a central cavity region housing an integrated circuit component such as a chip in which may be further provided with cover means for the central cavity in said member that can be formed with the same ceramic.

REFERENCES:
patent: 2308115 (1943-01-01), Schwartzwalder et al.
patent: 3844803 (1974-10-01), Blanke et al.
patent: 3955023 (1976-05-01), Blakely
patent: 4149899 (1979-04-01), Crookston
Alumina as a Ceramic Material, Walter H. Gitzen, 1970, pp. 130-134.

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