Electronic structure with components connected by way of...

Details Electronic structure with components connected by way of... Electronic structure with components connected by way of...

2006-11-17

2010-02-23

Monbleau, Davienne (Department: 2893)

Semiconductor device manufacturing: process

Coating with electrically or thermally conductive material

To form ohmic contact to semiconductive material

C438S106000, C257SE23021

Reexamination Certificate

active

07666777

ABSTRACT:
For the vertical electrical connection of a number of components, an electronic structure with at least two components has solderable connecting elements, which include at least one socket element and a solder ball stacked on the socket element. The socket element has a cylindrical core of an electrically conducting first material with a lateral surface, a bottom surface and a top surface. The core is surrounded with a cladding of an electrically insulating second material in such a way that the lateral surface of the core is covered by the cladding and the top surface and the bottom surface are kept free of the cladding.

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