Active solid-state devices (e.g. – transistors – solid-state diode – Including semiconductor material other than silicon or... – Group ii-vi compound
Reexamination Certificate
2006-12-19
2006-12-19
Parekh, Nitin (Department: 2811)
Active solid-state devices (e.g., transistors, solid-state diode
Including semiconductor material other than silicon or...
Group ii-vi compound
C257S613000, C257S652000, C257S118000
Reexamination Certificate
active
07151306
ABSTRACT:
A surface of an external electrode3of an electronic part4is formed with a coating containing resin ingredient. Thereby, adhesion strength and reliability may be significantly improved in mounting an electronic part onto a circuit board1through the medium of a conductive adhesive. Further, it will be able to mount an electronic part to an element to be mounted by utilizing a conductive adhesive forming an external electrode3as a connecting element.Further, surface roughness (Ra) of an external electrode3of an electronic part is set to 0.1 μm or more and to 10.0 μm or less and preferably to 1.0 μm or more and to 5.0 μm or less. Thereby, adhesion strength with a conductive adhesive may be significantly enhanced in comparison with a conventional electronic part presented.
REFERENCES:
patent: 5277723 (1994-01-01), Kodama et al.
patent: 5591941 (1997-01-01), Acocella et al.
patent: 5632833 (1997-05-01), Kurano et al.
patent: 5684677 (1997-11-01), Uchida et al.
patent: 5822176 (1998-10-01), Sano et al.
patent: 5952717 (1999-09-01), Taniguchi et al.
patent: 6137183 (2000-10-01), Sako
patent: 6249049 (2001-06-01), Kamada et al.
patent: 6264785 (2001-07-01), Ikeda
patent: 6271060 (2001-08-01), Zandman et al.
patent: 6274968 (2001-08-01), Wajima et al.
patent: 6297559 (2001-10-01), Call et al.
patent: 6759738 (2004-07-01), Fallon et al.
patent: 2001/0026017 (2001-10-01), Seto
patent: 7-312302 (1995-11-01), None
Ishimaru Yukihiro
Kitae Takashi
Mitani Tsutomu
Takezawa Hiroaki
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