Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Encapsulating
Reexamination Certificate
2011-04-19
2011-04-19
Bryant, Kiesha R (Department: 2891)
Semiconductor device manufacturing: process
Packaging or treatment of packaged semiconductor
Encapsulating
C257SE21503
Reexamination Certificate
active
07927925
ABSTRACT:
Spreading or keep out zones may be formed in integrated circuit packages by altering the roughness of package surfaces. The surface roughness can be altered by applying or growing particles having a dimension less than 500 nanometers. Hydrophilic surfaces may be made hemi-wicking and hydrophobic surfaces may be made hemi-wicking by particles of the same general characteristics.
REFERENCES:
patent: 6794225 (2004-09-01), Manepalli et al.
patent: 7112617 (2006-09-01), Kim et al.
patent: 2002/0060368 (2002-05-01), Jiang
patent: 2005/0121310 (2005-06-01), Yamada et al.
patent: 2005/0167647 (2005-08-01), Huang et al.
patent: 2007/0134937 (2007-06-01), See et al.
D. Qin, Y. Xia, B. Xu, H. Yang, C. Zhu, G. M. Whitesides, Fabrication of Ordered Two-Dimensional Arrays of Micro- and Nanoparticles Using Patterned Self-Assembled Monolayers as Templates, Advanced Materials, vol. 11, Issue 17, pp. 1433-1437, Dec. 1999.
Srinivasan, U.; Liepmann, D.; Howe, R.T.; Microstructure to substrate self-assembly using capillary forces, Microelectromechanical Systems, Journal of , vol. 10, No. 1, pp. 17-24, Mar 2001.
Xiaorong Xiong; Hanein, Y.; Jiandong Fang; Yanbing Wang; Weihua Wang; Schwartz, D.T.; Bohringer, K.F.; Controlled multibatch self-assembly of microdevices, Microelectromechanical Systems, Journal of , vol. 12, No. 2, pp. 117-127, Apr. 2003.
Chakrapani Nirupama
Matayabas Chris
Wakharkar Vijay S.
Bryant Kiesha R
Intel Corporation
Tornow Mark W
Trop Pruner & Hu P.C.
LandOfFree
Electronic packages with fine particle wetting and... does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Electronic packages with fine particle wetting and..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Electronic packages with fine particle wetting and... will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-2650825