4. Semiconductor device manufacturing: process
  5. Packaging or treatment of packaged semiconductor
  6. Encapsulating

Vijay S. Wakharkar

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Electronic packages with fine particle wetting and...

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Encapsulating
Reexamination Certificate

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Flip-chip system and method of making same

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Including adhesive bonding step
Reexamination Certificate

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Flip-chip system and method of making same

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Flip chip
Reexamination Certificate

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Smart curing with a catalyst-functionalized surface

Coating processes – With pretreatment of the base – Preapplied reactant or reaction promoter or hardener
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Profile ID: LFUS-PAI-P-2220748

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