Electronic package with strain relief means and method of making

Details Electronic package with strain relief means and method of making Electronic package with strain relief means and method of making

1998-02-23

1999-03-02

Picardat, Kevin M.

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Metallic housing or support

438125, H01L 2144

Patent

active

058770437

ABSTRACT:
An electronic package which includes a flexible substrate, stiffener and chip. The chip is bonded to the substrate, which was secured to the stiffener. Strain relief means are utilized at various locations in the package to prevent problems (e.g., tape "wrinkling") associated with relatively large differences in coefficients of thermal expansion between the package's various elements.

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