4. Active solid-state devices (e.g., transistors, solid-state diode
  5. Housing or package
  6. With semiconductor element forming part

Mario Merlin

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Compression assembled electronic package having a plastic...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead
Reexamination Certificate

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Compression assembled electronic package having a plastic...

Active solid-state devices (e.g. – transistors – solid-state diode – Regenerative type switching device – With housing or external electrode
Reexamination Certificate

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Electronic package with snap-on perimeter wall

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package
Reexamination Certificate

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Press-fit diode for universal mounting

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With semiconductor element forming part
Reexamination Certificate

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Process to weld steel to copper

Electric heating – Metal heating – For bonding with pressure
Reexamination Certificate

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Profile ID: LFUS-PAI-P-2611144

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