Electronic package with compressible heatsink structure

Details Electronic package with compressible heatsink structure Electronic package with compressible heatsink structure

1997-07-01

1999-01-26

Tsai, Jey

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Incorporating resilient component

438108, 438119, 438612, 438613, H01L 2144, H01L 2148, H01L 2150

Patent

active

058638148

ABSTRACT:
An electronic package wherein an electronic device (e.g., chip) on a circuitized substrate of the package is thermally coupled to a heatsink in a separable manner using a plurality of compressible, thermally conductive members (e.g., solder balls). These members are compressed and permanently deformed as part of the thermal coupling.

REFERENCES:
patent: 4034468 (1977-07-01), Koopman
patent: 4254431 (1981-03-01), Babuka et al.
patent: 4770242 (1988-09-01), Daikoku et al.
patent: 4825284 (1989-04-01), Soga et al.
patent: 4993482 (1991-02-01), Dolbear et al.
patent: 5088007 (1992-02-01), Missele
patent: 5444300 (1995-08-01), Saro et al.
patent: 5474458 (1995-12-01), Vafi et al.

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