Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – On insulating carrier other than a printed circuit board
Reexamination Certificate
2005-01-11
2005-01-11
Williams, Alexander Oscar (Department: 2826)
Active solid-state devices (e.g., transistors, solid-state diode
Lead frame
On insulating carrier other than a printed circuit board
C257S777000, C257S686000, C257S685000, C257S723000, C257S737000, C257S738000, C257S778000, C257S784000, C257S786000, C361S760000, C361S749000, C700S001000, C700S086000, C365S052000, C438S107000, C438S109000, C438S125000
Reexamination Certificate
active
06841855
ABSTRACT:
An electronic package is provided, having a flexible substrate, a first plurality of conductors, and a second plurality of conductors. The flexible substrate has first and second portions with a fold portion between the first and second portions, and is folded at the fold portion to position the second portion over the first portion. Each one of the first plurality of conductors runs from the first portion over the fold portion onto the second portion. Each one of the second plurality of conductors runs from the first portion onto the second portion without running over the fold portion.
REFERENCES:
patent: 4781601 (1988-11-01), Kuhl et al.
patent: 5220488 (1993-06-01), Denes
patent: 5224023 (1993-06-01), Smith et al.
patent: 5345205 (1994-09-01), Kornrumpf
patent: 5448511 (1995-09-01), Paurus et al.
patent: 5459641 (1995-10-01), Kuriyama
patent: 5646446 (1997-07-01), Nicewarner et al.
patent: 5805422 (1998-09-01), Otake et al.
patent: 5956234 (1999-09-01), Mueller
patent: 6699730 (2004-03-01), Kim et al.
patent: 20010006252 (2001-07-01), Kim et al.
patent: 20020050641 (2002-05-01), Freeman
patent: 20020164838 (2002-11-01), Moon et al.
patent: 20030069654 (2003-04-01), Larson
patent: 20040115866 (2004-06-01), Bang et al.
patent: 20010124527 (2004-07-01), Chiu
Chiu Chia-Pin
Jaeck Edward W.
Blakely , Sokoloff, Taylor & Zafman LLP
Intel Corporation
Williams Alexander Oscar
LandOfFree
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