Electronic package having a flexible substrate with ends...

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – On insulating carrier other than a printed circuit board

Reexamination Certificate

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C257S777000, C257S686000, C257S685000, C257S723000, C257S737000, C257S738000, C257S778000, C257S784000, C257S786000, C361S760000, C361S749000, C700S001000, C700S086000, C365S052000, C438S107000, C438S109000, C438S125000

Reexamination Certificate

active

06841855

ABSTRACT:
An electronic package is provided, having a flexible substrate, a first plurality of conductors, and a second plurality of conductors. The flexible substrate has first and second portions with a fold portion between the first and second portions, and is folded at the fold portion to position the second portion over the first portion. Each one of the first plurality of conductors runs from the first portion over the fold portion onto the second portion. Each one of the second plurality of conductors runs from the first portion onto the second portion without running over the fold portion.

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patent: 20010124527 (2004-07-01), Chiu

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