Electronic package comprising a substrate and a semiconductor de

Details Electronic package comprising a substrate and a semiconductor de Electronic package comprising a substrate and a semiconductor de

1997-09-12

1998-07-07

Lam, Cathy F.

Stock material or miscellaneous articles

Structurally defined web or sheet

Discontinuous or differential coating, impregnation or bond

428901, 252503, 252511, 252512, 252514, B32B 900, H01B 106

Patent

active

057765871

ABSTRACT:
A composition containing a polymeric matrix and a conductive filler component is provided. The conductive filler component comprises conductive particles and a polymer selected from the group consisting of substituted and unsubstituted polyanilines, substituted and unsubstituted polyparaphenylenevinylenes, substituted and unsubstituted polythiophenes, substituted and unsubstituted polyazines, substituted and unsubstituted polyparaphenylenes, substituted and unsubstituted polyfuranes, substituted and unsubstituted polypyrroles, substituted and unsubstituted polyselenophene, substituted and unsubstituted poly-p-phenylene sulfides and substituted and unsubstituted polyacetylenes, and mixtures thereof, and copolymers thereof. The compositions of the present invention are useful as adhesives for interconnecting a semiconductor chip to a substrate.

REFERENCES:
patent: 5002818 (1991-03-01), Licari et al.
patent: 5654081 (1997-08-01), Todd
patent: 5714252 (1998-02-01), Hoyerton et al.

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