Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Patent
1997-02-27
1999-10-19
Thompson, Gregory
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
174252, 174254, 361707, 361720, 361749, H05K 720
Patent
active
059699450
ABSTRACT:
A screen printing fixture holds a flexible circuit board having components attached to one side, to allow screening a pattern of solder paste onto the second side for subsequent attachment of components to that side. In an electronic package assembly a flexible circuit board with components is wound about a heat spreader assembly having a cavity so that at least one component on the flexible circuit board is positioned within the cavity and in thermal connection to the heat spreader.
REFERENCES:
patent: 3781596 (1973-12-01), GAlli et al.
patent: 3868724 (1975-02-01), Perrino
patent: 4149219 (1979-04-01), Kraft
patent: 4460224 (1984-07-01), Stopper
patent: 4567543 (1986-01-01), Miniet
patent: 4645732 (1987-02-01), Young
patent: 4677528 (1987-06-01), Miniet
patent: 4682269 (1987-07-01), Pitasi
patent: 4682270 (1987-07-01), Whitehead et al.
patent: 4761881 (1988-08-01), Bora et al.
patent: 4811165 (1989-03-01), Currier et al.
patent: 4834660 (1989-05-01), Cotti
patent: 4858073 (1989-08-01), Gregory
patent: 4928206 (1990-05-01), Porter et al.
patent: 4945029 (1990-07-01), Bronnenberg
patent: 4998342 (1991-03-01), Bonnell et al.
patent: 5112694 (1992-05-01), Konotsune et al.
patent: 5121297 (1992-06-01), Haas
patent: 5144742 (1992-09-01), Lucas et al.
patent: 5159751 (1992-11-01), Cottingham et al.
patent: 5168430 (1992-12-01), Nitsch et al.
patent: 5179501 (1993-01-01), Ocken et al.
patent: 5218516 (1993-06-01), Collins et al.
patent: 5219640 (1993-06-01), Gazit et al.
patent: 5224023 (1993-06-01), Smith et al.
patent: 5228192 (1993-07-01), Salatino
patent: 5261593 (1993-11-01), Casson et al.
patent: 5288542 (1994-02-01), Cibulsky et al.
patent: 5288950 (1994-02-01), Ushio et al.
patent: 5345205 (1994-09-01), Kornrumpf
patent: 5362656 (1994-11-01), McMahon
patent: 5378306 (1995-01-01), Cibulsky et al.
patent: 5450286 (1995-09-01), Jaques et al.
patent: 5452182 (1995-09-01), Eichelberger et al.
IBM Tech. Disc. Bulletin vol. 25 No. 7B Dec. 82 "Integral Heatsink Printed Circuit Card".
IBM Tech. Disc. Bulletin vol. 21 No. 9 Feb. 79 Multifunction Plug for IC Package.
IBM Tech. Disc. Bulletin vol. 26 No. 12 May 84' Multilayer Flexible Film Module.
IBM Tech. Disc. Bulletin vol. 30 No. 3 Aug. 87' "Concept for Forming Multilayer Structures for Electronic Packaging".
IBM Tech. Disc. Bulletin vol. 32 No. 4A Sep. 89' "Removal of Heat from Direct Chip Attach Circuitry".
Cutting Lawrence R.
Gaynes Michael A.
Johnson Eric A.
Milkovich Cynthia S.
Perkins Jeffrey S.
International Business Machines - Corporation
Pivnichny John R.
Thompson Gregory
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