Electronic module with conductively heat-sunk components

Details Electronic module with conductively heat-sunk components Electronic module with conductively heat-sunk components

1998-10-22

1999-12-07

Thompson, Gregory

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

165 802, 165185, 174 163, 361715, 361719, H05K 720

Patent

active

05999407&

ABSTRACT:
A heat transfer arrangement for one or more heat-generating components (18a) on a printed-circuit board (16) includes a heat transfer plate (316) defining an aperture (416) registered with the components. A "vertically" movable heatsink adapter (410) is adjusted to juxtapose its "lower" surface with the "upper" surface of the components to be heat-sunk. A heat-transfer pad (318) may be used between the heatsink adapter (410) and the component (18a). In various embodiments, the heatsink adapter takes the form of circular (410) or rectangular (410R) plugs, a draw-tube (808) arrangement, or a bellows (1010).

REFERENCES:
patent: 4621304 (1986-11-01), Oogaki et al.
patent: 4942497 (1990-07-01), Mine et al.
patent: 4962444 (1990-10-01), Niggemann
patent: 5396401 (1995-03-01), Nemoz
patent: 5414592 (1995-05-01), Stout et al.
patent: 5887435 (1999-03-01), Morton

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