Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Smart card package
Patent
1994-01-25
1996-06-04
Crane, Sara W.
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
Smart card package
257678, 257738, 235380, 235492, 235488, 174 524, 174260, H01L 2302, G06K 500, H01B 1716
Patent
active
055236189
DESCRIPTION:
BRIEF SUMMARY
FIELD OF THE INVENTION
This invention relates to the field of electronic labels in which a memory is provided with information to be read for identifying an article to which the lable is attached.
BACKGROUND OF THE INVENTION
The field of electronic labels is currently in full expansion. The systems in question comprise an electronic memory with either a read-only function (ROM), or a read-write function (RAM, EPROM, EEPROM) allowing information relating to the product to which the label is affixed to be recorded and read.
Certain of these labels are relatively large, but there is a real trend towards miniaturization, so that these labels can be discreetly accommodated in all sorts of products.
Furthermore, the current trend is to be able to read the label at a certain distance, which necessitates the incorporation of a coil for transmitting non-contact signals.
Although very miniaturized versions have already been developed, notably electronic labels for implanting in animals, or ultra-flat models which can be incorporated within a standard "credit card" format, this is not sufficient for certain applications.
SUMMARY OF THE INVENTION
This invention concerns a miniature electronic label where the coil has been replaced by a system of direct access via contacts. This electronic label, which comprises an integrated memory circuit that is electrically accessible via two tie lines or input/output conductors it comprises a metallic card which serves as a support, said card being connected electrically to the first input/output conductor or tie line, and comprising an aperture via which a contact zone connected at least indirectly to the second input/output conductor or tie line can be accessed.
BRIEF DESCRIPTION OF THE DRAWINGS
FIGS. 1A and 1B are, respectively, sectional side elevation and top plan views; of a first general embodiment of an electronic label according to the invention;
FIG. 2A is a side elevation in partial section of the embodiment of a label in accordance with FIGS. 1A and 1B showing further details of interconnections of the parts thereof; FIG. 2B is a top plan view of the label of FIG. 2A; FIGS. 2C and 2D are enlarged side elevations of portions C and D of FIG. 2A;
FIGS. 3 and 4 are side elevations of labels assembled with objects.
FIG. 5 is a side elevation of a further embodiment of a label according to the invention; and;
FIG. 6 is a top plan view of the embodiment of FIG. 5.
Description of the Preferred Embodiments
FIGS. 1A and 1B show a circular metallic card 1 with hole a 2 at the center thereof. A thin interconnection interface 3 of the printed circuit board type is mounted on said card. Finally, an integrated memory circuit 4 is in turn mounted on the printed circuit 3 and fixed by means of an adhesive thread 5. FIGS. 2A-2D show the interconnections between theses different elements in greater detail.
The electronic label thus formed can be mounted in a machined housing 6 or preformed housing 7 as shown in FIGS. 3 and 4, in any object for which the electronic label is intended. This label is particularly well suited for use on metallic objects where it can be ensured that the housing has a certain rigidity. Furthermore, the metallic card can be made of the same metal as that of the housing in which it is to be affixed. Thus, if housings 6 and 7 are contrived in objects made of gold, the card 1 will also be made of gold. This is significant; precious materials such as gold or platinum are chosen because of the very strict regulations for obtaining official stamps. Moreover, bearing in mind the very small dimensions which can be achieved, a typical example being a diameter of 5 mm and a height of 0.5 mm, this label is particularly discreet.
To mount the electronic label in housings 6, 7 as shown in FIGS. 3 and 4, a pre-adhered zone 8 can be provided on interface 3, allowing the label to be affixed within its housing by means of thermal bonding.
FIGS. 2A-2D show some details of the possible interconnections between the different elements shown in FIGS. 1A and 1B. The metallic
REFERENCES:
patent: 4004133 (1977-01-01), Hannan et al.
patent: 4649418 (1987-03-01), Uden
Crane Sara W.
Farley Walter C.
Gay Freres Vente et Exportation
Jr. Carl Whitehead
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