Electronic devices having metallurgies containing copper-semicon

Details Electronic devices having metallurgies containing copper-semicon Electronic devices having metallurgies containing copper-semicon

1995-05-24

1997-05-27

Utech, Benjamin

Coating processes

Immersion or partial immersion

Metal base

427438, 4274431, 4274432, B05D 118

Patent

active

056330472

ABSTRACT:
Silicon and germanium containing materials are used at surface of conductors in electronic devices. Solder can be fluxlessly bonded and wires can be wire bonded to these surfaces. These material are used as a surface coating for lead frames for packaging integrated circuit chips. These materials can be decal transferred onto conductor surfaces or electrolessly or electrolytically disposed thereon.

REFERENCES:
patent: 4657632 (1987-04-01), Holtzman et al.
patent: 4878253 (1989-10-01), Dixon, Jr.
patent: 4970107 (1990-11-01), Akahashi et al.
patent: 5258200 (1993-11-01), Mayernik
patent: 5284798 (1994-02-01), Ibuka et al.

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