Electronic devices formed of two or more substrates bonded...

Static information storage and retrieval – Systems using particular element – Magnetic thin film

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

C365S158000, C365S173000, C365S230060

Reexamination Certificate

active

07969774

ABSTRACT:
Electronic devices comprise a first substrate and a second substrate. The first substrate comprises circuitry including a plurality of conductive traces at least substantially parallel to each other through at least a portion of the first substrate. A plurality of bond pads is positioned on a surface of the first substrate and comprises a width extending over at least two of the plurality of conductive traces. A plurality of vias extends from adjacent at least some of the conductive traces to the plurality of bond pads. The second substrate is bonded to the first substrate and comprises support circuitry coupled to the plurality of bond pads on the first substrate with a plurality of conductive bumps. Memory devices and related methods of forming electronic devices and memory devices are also disclosed, as are electronic systems.

REFERENCES:
patent: 5672400 (1997-09-01), Hansen et al.
patent: 6025618 (2000-02-01), Chen
patent: 6124634 (2000-09-01), Akram et al.
patent: 6218731 (2001-04-01), Huang et al.
patent: 6391658 (2002-05-01), Gates et al.
patent: 6583502 (2003-06-01), Lee et al.
patent: 6693002 (2004-02-01), Nakamura et al.
patent: 6787917 (2004-09-01), Lee et al.
patent: 6834005 (2004-12-01), Parkin
patent: 6887769 (2005-05-01), Kellar et al.
patent: 6898132 (2005-05-01), Parkin
patent: 6920062 (2005-07-01), Parkin
patent: 7037804 (2006-05-01), Kellar et al.
patent: 7057249 (2006-06-01), Anthony et al.
patent: 7236386 (2007-06-01), Parkin
patent: 7439082 (2008-10-01), Rinerson et al.
patent: 7474004 (2009-01-01), Leedy
patent: 7622377 (2009-11-01), Lee et al.
patent: 2005/0078511 (2005-04-01), Parkin
patent: 2005/0091440 (2005-04-01), Isa et al.
patent: 2008/0042179 (2008-02-01), Haller et al.
patent: 2008/0044930 (2008-02-01), Gupta
patent: 2008/0105864 (2008-05-01), Park
patent: 2008/0112240 (2008-05-01), Han
patent: 2008/0239785 (2008-10-01), Gaidis et al.
patent: 2008/0268618 (2008-10-01), Yamazaki
patent: 2008/0283995 (2008-11-01), Bucki et al.
patent: 2008/0288720 (2008-11-01), Atwal et al.
patent: 2005-135453 (2005-05-01), None
patent: 2007-150208 (2007-06-01), None
Devarajan et al., Die-on-Wafer and Wafer-Level Three Dimensional (3D) Integration of Heterogeneous IC Technologies for RF-Microwafe-Millimeter Applications, Mater. Res. Soc. Symp. Proc. vol. 833, 2005, pp. 229-234.
International Search Report, International Application No. PCT/US2010/026235, mailed Sep. 27, 2010, three (3) pages.
Written Opinion of the International Searching Authority, International Application No. PCT/US2010/026235, mailed Sep. 27, 2010, three (3) pages.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Electronic devices formed of two or more substrates bonded... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Electronic devices formed of two or more substrates bonded..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Electronic devices formed of two or more substrates bonded... will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-2719740

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.