Electronic devices

Adhesive bonding and miscellaneous chemical manufacture – Delaminating processes adapted for specified product – Delaminating in preparation for post processing recycling step

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Details

156646, 156651, 156656, 156657, 1566591, 1566611, 156662, 20419235, 20419237, 252 791, H01L 21306, B44C 122, C23F 102, C03C 1500

Patent

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049683829

ABSTRACT:
In the production of micron-size pyramid emitters for field emission devices, very sharp emitter points are achieved by providing a layer of suitable metal, metal compound or semiconductor, forming masking pads over the required emitter positions, etching the layer so that column-like structures are formed beneath the pads, removing the pads, and then subjecting the columns to dry etching, such as plasma etching, reactive ion etching, ion beam milling or reactive ion beam milling. The dry etching process shapes the columns into pyramids with a tip size of the order of 0.03 microns.

REFERENCES:
patent: 3045321 (1962-07-01), McDermott
patent: 3998678 (1976-12-01), Fukase et al.
patent: 4685996 (1987-08-01), Busta et al.
patent: 4874463 (1989-10-01), Koze et al.
patent: 4916002 (1990-04-01), Carver

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