Electronic device package and method of manufacturing the same

Details Electronic device package and method of manufacturing the same Electronic device package and method of manufacturing the same

2009-11-03

2010-11-23

Toledo, Fernando L (Department: 2895)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

C438S006000, C438S015000, C438S025000, C438S026000, C438S051000, C438S055000, C438S064000, C438S068000, C438S118000, C438S125000, C438S119000, C438S460000, C438S774000, C438S613000, C438S387000, C257S686000, C257S700000, C257SE23067

Reexamination Certificate

active

07838333

ABSTRACT:
The present invention discloses an electronic device package and a method of the package. In particular, an electronic device package and a method of the package suitable for a bumpless electronic device package with enhanced electrical performance and heat-dissipation efficiency are disclosed. The method comprises: providing a substrate having a plurality of vias and a plurality of electronic devices; forming a gluing layer on a surface of the substrate and fixing the electronic devices on the gluing layer, wherein the electronic devices have I/O units aligned with the vias respectively; forming a plurality of fixing layers in the gaps between the electronic devices; trenching a plurality of openings aligned with the vias respectively in the fixing layer; forming a plurality of metallic conductive units in the vias, the openings and part of the surface of the substrate; and forming a passivation layer over the other surface of the substrate.

REFERENCES:
patent: 4786357 (1988-11-01), Campanelli et al.
patent: 4875968 (1989-10-01), O'Neill et al.
patent: 4961821 (1990-10-01), Drake et al.
patent: 5068006 (1991-11-01), Fisher
patent: 5229785 (1993-07-01), Leban
patent: 5308442 (1994-05-01), Taub et al.
patent: 5387314 (1995-02-01), Baughman et al.
patent: 5408739 (1995-04-01), Altavela et al.
patent: 5557844 (1996-09-01), Bhatt et al.
patent: 5581861 (1996-12-01), Lee et al.
patent: 5677575 (1997-10-01), Maeta et al.
patent: 5789278 (1998-08-01), Akram et al.
patent: 5828394 (1998-10-01), Khuri-Yakub et al.
patent: 5870289 (1999-02-01), Tokuda et al.
patent: 5890745 (1999-04-01), Kovacs
patent: 5909010 (1999-06-01), Inoue
patent: 6013948 (2000-01-01), Akram et al.
patent: 6039439 (2000-03-01), Komplin et al.
patent: 6126140 (2000-10-01), Johnson et al.
patent: 6127198 (2000-10-01), Coleman et al.
patent: 6235212 (2001-05-01), Silverbrook
patent: 6235554 (2001-05-01), Akram et al.
patent: 6242321 (2001-06-01), Acosta et al.
patent: 6265765 (2001-07-01), DiStefano et al.
patent: 6297553 (2001-10-01), Horiuchi et al.
patent: 6365974 (2002-04-01), Abbott et al.
patent: 6409311 (2002-06-01), Gooray et al.
patent: 6449831 (2002-09-01), Komplin et al.
patent: 6482574 (2002-11-01), Ramaswami et al.
patent: 6482730 (2002-11-01), Masumoto et al.
patent: 6521485 (2003-02-01), Su et al.
patent: 6521530 (2003-02-01), Peters et al.
patent: 6540337 (2003-04-01), Pollard
patent: 6555906 (2003-04-01), Towle et al.
patent: 6586822 (2003-07-01), Vu et al.
patent: 6586836 (2003-07-01), Ma et al.
patent: 6608371 (2003-08-01), Kurashima et al.
patent: 6612535 (2003-09-01), Tai et al.
patent: 6626520 (2003-09-01), Hawkins et al.
patent: 6628178 (2003-09-01), Uchikoba
patent: 6664485 (2003-12-01), Bhatt et al.
patent: 6781484 (2004-08-01), Matsuta
patent: 6784765 (2004-08-01), Yamada et al.
patent: 6796019 (2004-09-01), Komplin et al.
patent: 6820328 (2004-11-01), Barcley
patent: 6833613 (2004-12-01), Akram et al.
patent: 6863382 (2005-03-01), Anagnostopoulos et al.
patent: 6873529 (2005-03-01), Ikuta et al.
patent: 6874867 (2005-04-01), DeBar et al.
patent: 6905914 (2005-06-01), Huemoeller et al.
patent: 6915566 (2005-07-01), Abbott et al.
patent: 6938310 (2005-09-01), Hawkins et al.
patent: 6966110 (2005-11-01), DeBar et al.
patent: 6966112 (2005-11-01), Kawamura
patent: 7001798 (2006-02-01), Yamaguchi
patent: 7011392 (2006-03-01), Chen et al.
patent: 7018015 (2006-03-01), Truninger et al.
patent: 7041534 (2006-05-01), Chao et al.
patent: 7267431 (2007-09-01), Anderson et al.
patent: 7279402 (2007-10-01), Yamada
patent: 7350406 (2008-04-01), Yabe et al.
patent: 7420272 (2008-09-01), Huemoeller et al.
patent: 7438030 (2008-10-01), Okojie
patent: 7575953 (2009-08-01), Tan et al.
patent: 2002/0017710 (2002-02-01), Kurashima et al.
patent: 2002/0145647 (2002-10-01), Kataoka et al.
patent: 2003/0017647 (2003-01-01), Kwon et al.
patent: 2004/0004281 (2004-01-01), Bai et al.
patent: 2004/0212389 (2004-10-01), Hamren et al.
patent: 2004/0223309 (2004-11-01), Haemer et al.
patent: 2005/0087859 (2005-04-01), Chao et al.
patent: 2005/0185382 (2005-08-01), Ooi et al.
patent: 2005/0241754 (2005-11-01), Iri et al.
patent: 2005/0287708 (2005-12-01), Kim et al.
patent: 2006/0019484 (2006-01-01), Chen et al.
patent: 2006/0151847 (2006-07-01), Kwon et al.

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