4. Semiconductor device manufacturing: process
  5. Packaging or treatment of packaged semiconductor

Jyh-Rong Lin

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Electronic device package and method of manufacturing the same

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor
Reexamination Certificate

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Electronic device package and method of manufacturing the same

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor
Reexamination Certificate

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Packaging structure and method of an image sensor module

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Having light transmissive window
Reexamination Certificate

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Packaging structure and method of an image sensor module

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Flip chip
Reexamination Certificate

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Wafer level package incorporating elastomeric pads in dummy...

Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
Reexamination Certificate

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Profile ID: LFUS-PAI-P-2104491

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