Electronic device package

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Die bond

Reexamination Certificate

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Details

C257S787000, C257S788000, C257SE23116, C257SE23136

Reexamination Certificate

active

07122908

ABSTRACT:
An electronic device package comprises a substrate, a die, and a material having a Young's modulus of between about 0.1 megapascals and about 20 megapascals (at a solder reflow temperature) for attaching the die to the substrate. In one embodiment, the package utilizes a material having a Young's modulus of between about 0.1 megapascals and about 20 megapascals (at a solder reflow temperature) for attaching the die to the substrate. In an alternate embodiment, the package utilizes a material having a coefficient of thermal expansion α2of less than about 400 (four-hundred) ppm (parts per million)/° C. for attaching the die to the substrate. In another alternate embodiment, the package utilizes a rigid material for attaching the die to the substrate.

REFERENCES:
patent: 4734464 (1988-03-01), Biensan
patent: 5001542 (1991-03-01), Tsukagoshi et al.
patent: 5148265 (1992-09-01), Khandros et al.
patent: 5148266 (1992-09-01), Khandros et al.
patent: 5347159 (1994-09-01), Khandros et al.
patent: 5550408 (1996-08-01), Kunitomo et al.
patent: 5552637 (1996-09-01), Yamagata
patent: 5679977 (1997-10-01), Khandros et al.
patent: 5685885 (1997-11-01), Khandros et al.
patent: 5759874 (1998-06-01), Okawa
patent: 5773877 (1998-06-01), Hu et al.
patent: 5852326 (1998-12-01), Khandros et al.
patent: 5950304 (1999-09-01), Khandros et al.
patent: 6049094 (2000-04-01), Penry
patent: 6049129 (2000-04-01), Yew et al.
patent: 6057381 (2000-05-01), Ma et al.
patent: 6133627 (2000-10-01), Khandros et al.
patent: 6144107 (2000-11-01), Narita
patent: 6225418 (2001-05-01), Satsu et al.
patent: 6265782 (2001-07-01), Yamamoto et al.
patent: 6265784 (2001-07-01), Kawano et al.
patent: 6395124 (2002-05-01), Oxman et al.
patent: 6429372 (2002-08-01), Taguchi et al.
patent: 6433419 (2002-08-01), Khandros et al.
patent: 6465893 (2002-10-01), Khandros et al.
patent: 2001/0009780 (2001-07-01), Takeda et al.
patent: 0816461 (1998-01-01), None
patent: 2000212518 (2000-02-01), None
patent: 212518 (2000-08-01), None

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