Electronic device having electric wires and method of producing

Details Electronic device having electric wires and method of producing Electronic device having electric wires and method of producing

1998-05-12

2000-02-22

Heinrich, Samuel M.

Metal fusion bonding

Process

Using high frequency vibratory energy

2281115, 2281732, 228265, 2281805, H05K 334, H01L 21603, H01L 21607

Patent

active

06027008&

ABSTRACT:
An electronic device such as a chip coil including an electric wire firmly connected to electrodes in a highly reliable fashion is constructed to be mounted on a printed circuit board or substrate in a stable and reliable manner. At both ends of a core of the chip coil, there are provided electrodes having a multilayer structure including a high-conductivity layer made of Ag, Ag--Pd, or a similar material; a solder barrier layer made of Ni; and an easy-soldering layer made of Sn or solder. End portions of the electric wire are embedded in the easy-soldering layer so that the resultant electrode structure has a substantially flat surface. A thermo-compression process is performed so that the end portions of the electric wire are connected to the solder barrier layer via solid welding and to the easy-soldering layer via brazing.

REFERENCES:
patent: 3672047 (1972-06-01), Sakamoto et al.
patent: 3733685 (1973-05-01), Kauppila
patent: 4752266 (1988-06-01), Vrijssen
patent: 4907734 (1990-03-01), Conru et al.
patent: 4948030 (1990-08-01), Chason et al.
patent: 5495976 (1996-03-01), Mironesco et al.

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