Electronic device having electric wires and method of producing

Details Electronic device having electric wires and method of producing Electronic device having electric wires and method of producing

1999-11-03

2000-09-19

Heinrich, Samuel M.

Metal fusion bonding

Process

Plural joints

2282331, 228254, B23K 2000

Patent

active

061199249

ABSTRACT:
An electronic device such as a chip coil including an electric wire firmly connected to electrodes in a highly reliable fashion is constructed to be mounted on a printed circuit board or substrate in a stable and reliable manner. At both ends of a core of the chip coil, there are provided electrodes having a multilayer structure including a high-conductivity layer made of Ag, Ag--Pd, or a similar material; a solder barrier layer made of Ni; and an easy-soldering layer made of Sn or solder. End portions of the electric wire are embedded in the easy-soldering layer so that the resultant electrode structure has a substantially flat surface. A thermo-compression process is performed so that the end portions of the electric wire are connected to the solder barrier layer via solid welding and to the easy-soldering layer via brazing.

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patent: 4004843 (1977-01-01), Boenning et al.
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patent: 4537461 (1985-08-01), Ouellette
patent: 4673772 (1987-06-01), Satoh et al.
patent: 4777461 (1988-10-01), Sakamoto
patent: 5139433 (1992-08-01), Bohaty
patent: 5561587 (1996-10-01), Sanada
patent: 5946597 (1999-08-01), Miura et al.

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