Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings
Reexamination Certificate
2005-05-17
2005-05-17
Clark, Jasmine (Department: 2815)
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
Multiple housings
C257S685000, C257S777000, C438S109000, C438S107000, C438S110000
Reexamination Certificate
active
06894381
ABSTRACT:
The invention relates to an electronic device having a stack of semiconductor chips, and to a method for the production thereof. A first semiconductor chip is arranged on a rewiring substrate, and at least one semiconductor stack chip is arranged on the first semiconductor chip. A rewiring plane is arranged between the semiconductor chips. The contact areas of the semiconductor chips are connected to external contacts of the device by the rewiring plane and the rewiring substrate.
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Hetzel Wolfgang
Legen Anton
Thomas Jochen
Clark Jasmine
Dicke Billig & Czaja, PLLC
Infineon - Technologies AG
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