Electronic device having a stack of semiconductor chips and...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings

Reexamination Certificate

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Details

C257S685000, C257S777000, C438S109000, C438S107000, C438S110000

Reexamination Certificate

active

06894381

ABSTRACT:
The invention relates to an electronic device having a stack of semiconductor chips, and to a method for the production thereof. A first semiconductor chip is arranged on a rewiring substrate, and at least one semiconductor stack chip is arranged on the first semiconductor chip. A rewiring plane is arranged between the semiconductor chips. The contact areas of the semiconductor chips are connected to external contacts of the device by the rewiring plane and the rewiring substrate.

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patent: 5861666 (1999-01-01), Bellaar
patent: 6163070 (2000-12-01), Mori
patent: 6303997 (2001-10-01), Lee
patent: 6472736 (2002-10-01), Yeh et al.
patent: 6545366 (2003-04-01), Michii et al.
patent: 6683385 (2004-01-01), Tsai et al.
patent: 6686656 (2004-02-01), Koh et al.
patent: 20010005042 (2001-06-01), Burns
patent: 100 23 823 (2001-12-01), None
patent: 2002057272 (2002-02-01), None
patent: 2000-0042112 (2000-07-01), None
patent: 2001-028845 (2001-04-01), None

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