Electronic device for testing bonding wire integrity

Details Electronic device for testing bonding wire integrity Electronic device for testing bonding wire integrity

1996-05-17

1999-06-01

Hardy, David B.

Active solid-state devices (e.g., transistors, solid-state diode

Test or calibration structure

257773, 257784, 257786, H01L 2349

Patent

active

059090340

ABSTRACT:
A device presenting pairs of split contact pad portions, each pair of pads having multiple bonding wire, and metal connecting strips associated therewith. The end portion of the metal connecting strips being split into parallel strip segments, each connected to a respective contact pad, so as to form a plurality of parallel current paths between a node and an external contact pin connected to the node. When current is supplied along the connecting strip a voltage drop along each segment connected to a sound bonding wire is produced, but not along the segments connected to broken or non-bonded wires. By determining the existence of a voltage difference between the contact pad portions, it is possible to detect the interruption of one or more of the bonding wires.

REFERENCES:
patent: 4439841 (1984-03-01), Itoh et al.
patent: 4467345 (1984-08-01), Ozawa
patent: 4979016 (1990-12-01), Lee
patent: 5101154 (1992-03-01), Hollstein et al.
patent: 5477079 (1995-12-01), Hiruta
European Search Report from European Patent Application No. 95830214.3, filed May 19, 1995.

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