Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
Patent
1998-10-30
2000-06-06
Niebling, John F.
Semiconductor device manufacturing: process
Coating with electrically or thermally conductive material
To form ohmic contact to semiconductive material
257766, 257762, 257779, 3613061, 361309, H01L 2144, H01L 2348, H01G 4228
Patent
active
060718005
ABSTRACT:
An electronic device has an element assembly, in which electronic parts elements are disposed, and external electrodes of metal film which are formed on surfaces of the element assembly of the electronic device so as to extend and connect to the electronic parts elements, respectively. Further, in this electronic device, the external electrode is made up of an anchor layer adhered on the surface of the element assembly of the electronic device, a solder-resist layer formed to cover the anchor layer, and a solder-wettable layer formed to cover a surface of the solder-resistant layer and showing a superior wettability with respect to molten solder, in which the external electrode further comprises an intermediate layer provided between the solder-resistant layer and the solder-wettable layer and made of an alloy containing both metal materials forming the solder-resistant layer and the solder-wettable layer.
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Ono Yukio
Shigemoto Hiroya
Nguyen Ha Tran
Niebling John F.
Taiyo Yuden Co. Ltd.
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