Electronic device and heat sink assembly

Details Electronic device and heat sink assembly Electronic device and heat sink assembly

1991-01-28

1991-10-15

James, Andrew J.

Electricity: electrical systems and devices

Safety and protection of systems and devices

With specific current responsive fault sensor

357 75, 357 79, 357 80, 361381, 361386, 361389, H01L 2302, H01L 2316, H02B 100, H05K 720

Patent

active

050579096

ABSTRACT:
In integrated circuit packaging, chips are bonded to one side of an intermediate wafer that is resiliently mounted at the periphery with the entire other side of the intermediate wafer being maintained in conformal thermal transfer to external heat dissipation free of any solid connection.

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patent: 4323914 (1982-04-01), Berndlmaier et al.
patent: 4567505 (1986-01-01), Pease et al.
patent: 4651192 (1987-03-01), Matsushita et al.
patent: 4663649 (1987-05-01), Suzuki et al.
patent: 4823863 (1989-04-01), Nakajima et al.
patent: 4885662 (1989-12-01), Bartholomew et al.
"Ultra Reliable HWSI with Aluminum Nitride Packaging", by John K. Hagge, Electronic Packaging and Production, Sep. 1979, p. 1271.
"Module With Internal Elements for Reducing Thermal Resistance", by Arnold et al, IBM Technical Disclosure Bulletin, vol. 21, No. 4, Sep. 1978, pp. 1473 and 1474.
"Thermally Enhanced Semiconductor Chip Packaging Structure", by Coughlin et al., IBM Technical Disclosure Bulletin, vol. 21, No. 1, Jun. 1978, p. 185.

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