Electronic device and carrier substrate for same

Details Electronic device and carrier substrate for same Electronic device and carrier substrate for same

2007-08-07

2007-08-07

Clark, Jasmine (Department: 2815)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

For plural devices

C257S723000, C257S691000, C257S773000, C257S776000, C257S780000, C257S782000, C257S784000, C257S786000, C257SE23001, C257SE23015, C257SE23020, C257SE23060, C257SE23079, C257SE23153

Reexamination Certificate

active

10574882

ABSTRACT:
Consistent with an example embodiment, an electronic device comprises an integrated circuit and a carrier substrate with a bottom and top conductive layer, and is provided with voltage supply, ground and signal transmission connections. In order to enable the use of more than one supply voltage, the integrated circuit is subdivided into core functionality and peripheral functionality, and the carrier substrate is subdivided into a corresponding core area and peripheral area. The ground connections of both core and periphery are mutually coupled through an interconnect in the carrier substrate. This interconnect is particularly a ground plane, and allows the provision of a transmission line character to the interconnects for signal transmission of the periphery.

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patent: 6448639 (2002-09-01), Ma
patent: 6509646 (2003-01-01), Lin et al.
patent: 6779783 (2004-08-01), Kung et al.
patent: 6930381 (2005-08-01), Cornelius
patent: 2002/0017399 (2002-02-01), Chang et al.
patent: 2002/0153605 (2002-10-01), Chang
patent: 0 743 929 (1998-07-01), None
patent: WO 96/23320 (1996-08-01), None
patent: WO 01/15182 (2001-03-01), None
patent: 2004-064151 (2004-07-01), None

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