Electronic device and carrier substrate

Details Electronic device and carrier substrate Electronic device and carrier substrate

2004-10-01

2008-09-30

Clark, Jasmine J (Department: 2815)

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Flip chip

C257S691000, C257S693000, C257S738000, C257S773000, C257S776000, C257S780000, C257S781000, C257S784000, C257S786000, C257SE23060, C257SE23079, C257SE23153, C257SE23001, C257SE23015, C257SE23020

Reexamination Certificate

active

07429797

ABSTRACT:
Consistent with an example embodiment, an electronic device comprises a semiconductor device, particularly an integrated circuit, and a carrier substrate with conductive layers on the first side and the second side, and voltage supply and ground connections mutually arranged according to a chessboard pattern. These connections extend in a direct path through vertical interconnects and bumps to bond pads at the integrated circuit, which bond pads are arranged in a corresponding chessboard pattern. As a result, an array of direct paths is provided, wherein the voltage supply connections form as much as possible the coaxial center conductors of a coaxial structure.

REFERENCES:
patent: 5900312 (1999-05-01), Sylvester
patent: 6388207 (2002-05-01), Figueroa et al.
patent: 6608379 (2003-08-01), Yeo et al.
patent: 6717066 (2004-04-01), Vandentop et al.
patent: 6800947 (2004-10-01), Sathe
patent: 7253516 (2007-08-01), Coenen
patent: 2003/0038378 (2003-02-01), Jacobs
patent: 2004/0238942 (2004-12-01), Chakravorty et al.

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