Electronic device

Details Electronic device Electronic device

2003-06-20

2009-06-30

Patel, Ishwar I. B. (Department: 2841)

Electricity: conductors and insulators

Conduits, cables or conductors

Preformed panel circuit arrangement

C174S260000

Reexamination Certificate

active

07554039

ABSTRACT:
In an electronic device having an interposer substrate as an MCM structure, heat dissipation properties are enhanced while the reliability of joint between the interposer substrate and a motherboard is maintained. In the invention, a metal core base material of great heat capacity and high thermal conductivity is used for both the interposer substrate and the motherboard. Furthermore, a part where a core metal is exposed is provided on at least one of the interposer substrate and the motherboard. A solder joint pad is directly formed on the core metal exposed part, and the interposer substrate is solder-joined to the motherboard.

REFERENCES:
patent: 6097089 (2000-08-01), Gaku et al.
patent: 6265772 (2001-07-01), Yoshida
patent: 6359341 (2002-03-01), Huang et al.
patent: 6525942 (2003-02-01), Huang et al.
patent: 2001/0025723 (2001-10-01), Kondo et al.
patent: 2002/0185718 (2002-12-01), Mikubo
patent: 2002/0189853 (2002-12-01), Hsu
patent: 05-175407 (1993-07-01), None
patent: 9-102683 (1997-04-01), None
patent: 2000-12765 (2000-01-01), None
patent: 2000-228452 (2000-08-01), None
patent: 2000-315747 (2000-11-01), None
patent: 2001-110928 (2001-04-01), None
patent: 2001-177202 (2001-06-01), None
patent: 2002-270743 (2002-09-01), None

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