Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Wire contact – lead – or bond
Patent
1997-10-20
2000-03-28
Clark, Sheila V.
Active solid-state devices (e.g., transistors, solid-state diode
Combined with electrical contact or lead
Wire contact, lead, or bond
257773, H01L 2348, H01L 2352, H01L 2940
Patent
active
060435631
ABSTRACT:
Spring contact elements are fabricated at areas on an electronic component remote from terminals to which they are electrically connected. For example, the spring contact elements may be mounted to remote regions such as distal ends of extended tails (conductive lines) which extend from a terminal of an electronic component to positions which are remote from the terminals. In this manner, a plurality of substantially identical spring contact elements can be mounted to the component so that their free (distal) ends are disposed in a pattern and at positions which are spatially-translated from the pattern of the terminals on the component. The spring contact elements include, but are not limited to, composite interconnection elements and plated-up structures. The electronic component includes, but is not limited to, a semiconductor device, a memory chip, a portion of a semiconductor wafer, a space transformer, a probe card, a chip carrier, and a socket.
REFERENCES:
patent: 4893172 (1990-01-01), Matsumoto et al.
patent: 5055780 (1991-10-01), Takagi et al.
patent: 5086337 (1992-02-01), Noro et al.
patent: 5191708 (1993-03-01), Kasukabe et al.
patent: 5354712 (1994-10-01), Ho et al.
patent: 5495667 (1996-03-01), Farnworth et al.
patent: 5602422 (1997-02-01), Schuller et al.
patent: 5629565 (1997-05-01), Schlaak et al.
patent: 5810609 (1998-09-01), Faraci et al.
patent: 5852871 (1998-12-01), Khandros
patent: 5864946 (1999-02-01), Eldridge et al.
patent: 5926951 (1999-07-01), Khandros et al.
Robust Method Using Simple Unit Processes For Thin Film Cu-Polyimide Packaging Structures, IBM Technical Disclosure Bulletin, vol. 34, No. 10A, Mar. 1, 1992, pp. 368-369, XP 000302335.
Eldridge Benjamin N.
Khandros Igor Y.
Mathieu Gaetan L.
Pedersen David V.
Clark Sheila V.
FormFactor Inc.
Larwood David
Linden Gerald E.
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