Electronic components on trenched substrates and method of...

Details Electronic components on trenched substrates and method of... Electronic components on trenched substrates and method of...

2008-02-13

2011-11-08

Bui, Hung S (Department: 2835)

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

C361S736000

Reexamination Certificate

active

08054630

ABSTRACT:
A method of mounting an electronic component on a substrate includes forming at least one trench in a surface of the substrate. The trenches formed in the substrate reduce a stiffness of the substrate, which provides less resistance to shear. Accordingly, the trenches reduce the amount of strain on the joints, which mount the electronic component to the substrate, which enhances the life of the joints.

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