Electronic component with compliant elevations having...

Details Electronic component with compliant elevations having... Electronic component with compliant elevations having...

2008-05-06

2008-05-06

Ghyka, Alexander (Department: 2812)

Semiconductor device manufacturing: process

Coating with electrically or thermally conductive material

To form ohmic contact to semiconductive material

C438S106000, C438S108000, C438S622000, C257SE23068

Reexamination Certificate

active

07368375

ABSTRACT:
An electronic component includes compliant elevations having electrical contact areas for contact-connecting the component to an electronic circuit. The compliant elevations are arranged on a surface of the component and the electrical contact areas are arranged on the tip of the compliant elevations. The electrical contact with the electronic circuit is embodied by means of electrical conductive tracks arranged on the surface of the component. The conductive tracks ascend on the outer surfaces of the compliant elevations to the electrical contact areas.

REFERENCES:
patent: 5685885 (1997-11-01), Khandros et al.
patent: 2003/0067755 (2003-04-01), Haimerl et al.
patent: WO 01/75969 (2001-10-01), None

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