Adhesive bonding and miscellaneous chemical manufacture – Surface bonding means and/or assembly means therefor – Presses or press platen structures – per se
Patent
1992-07-20
1995-05-30
Osele, Mark A.
Adhesive bonding and miscellaneous chemical manufacture
Surface bonding means and/or assembly means therefor
Presses or press platen structures, per se
156344, 221 73, 221 87, 226 52, 226115, 226158, 414416, B65H 2022
Patent
active
054198020
ABSTRACT:
An apparatus capable of supplying electronic components successively to a loading position of an electronic component mounting machine at a high speed and in a stable manner is disclosed, in which a dancing guide is operatively connected with a feeding unit for taking out a predetermined length of the electronic-component tape from a supply reel before feed pins of the feed unit advance a carrier tape of the electronic-component tape to move a leading one of the electronic components into the loading position. Preferably, the apparatus further includes a separating unit, operatively connected with the feed unit, for separating an adhesive tape from the leading electronic component and the carrier tape before said feed pins advance the carrier tape. The separating unit is composed of a pair of spaced movable guide rollers and a fixed guide roller.
REFERENCES:
patent: 3034692 (1962-05-01), Busch
patent: 3911646 (1975-10-01), Larkin et al.
patent: 4116747 (1978-09-01), Hamisch, Jr.
patent: 4191608 (1980-03-01), Bussard et al.
patent: 4547250 (1985-10-01), Murayama
patent: 4572421 (1986-02-01), Hug et al.
patent: 4620655 (1986-11-01), Fujita
patent: 4735341 (1988-04-01), Hamilton et al.
patent: 4869393 (1989-09-01), Soth
patent: 4887778 (1989-12-01), Soth et al.
patent: 4943342 (1990-07-01), Golemon
patent: 5014498 (1991-05-01), McMahon
Mitsushima Takatoshi
Morioka Manabu
Munezane Takashi
Nakatsuka Shigeki
Negisi Sigetosi
Matsushita Electric - Industrial Co., Ltd.
Osele Mark A.
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