Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material
Reexamination Certificate
1999-08-30
2001-02-06
Thomas, Tom (Department: 2811)
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
Insulating material
C257S702000, C257S737000, C257S778000, C257S783000, C257S795000, C257S782000, C361S748000, C361S750000, C361S757000, C361S762000
Reexamination Certificate
active
06184577
ABSTRACT:
TECHNICAL FIELD
This invention relates to an electronic component part device such as a semiconductor device. More particularly, it relates to an electronic component part device such as a semiconductor device in which connecting electrodes of a semiconductor chip and corresponding connecting electrodes on a semiconductor packaging substrate are brought into contact with one another and are fastened by bonding them with an adhesive such as an anisotropic conductive adhesive and at the same time the electrodes of the both are electrically interconnected.
BACKGROUND ART
As methods for packaging semiconductor chips directly on a packaging substrate by face-down bonding, commonly used are flip-chip bonding in which bumps are formed at electrode areas of a semiconductor chip followed by soldering to a packaging substrate, and a connecting method in which bump electrodes provided on a semiconductor chip are coated with a conductive adhesive and are bonded to electrodes of a packaging substrate.
An anisotropic conductive adhesive having conductive particles dispersed therein is also available as a means by which electronic component parts such as semiconductor chips are electrically interconnected to a packaging substrate by mechanical electrode connection. More specifically, an adhesive film is provided between electronic component parts and electrodes or circuits and then a pressing or heat-pressing step is taken whereby the electrodes of the both are electrically interconnected to one another and at the same time an insulation performance between adjacent electrodes is imparted, thus the electronic component part devices are bonded and fastened to the circuits. This method of packaging by mechanical electrode connection is presently applied to glass substrates, and also studies are being made on its application to wiring boards made of glass-cloth reinforced resins having high general-purpose properties.
In addition, as a method of connecting electronic component parts such as semiconductor chips electrically to a packaging substrate by mechanical electrode connection, a method is also proposed in which gold bumps are formed on electrodes of a semiconductor chip, then mechanically brought into contact with gold electrodes provided on the side of a packaging substrate and at the same time held and fastened by a thermosetting or photosetting adhesive.
The wiring boards made of glass-cloth reinforced resins, used as packaging substrates, can enjoy a higher wiring density and also are economically feasible for multi-layer wiring, thus they are most commonly put into used as wiring materials. However, conventional wiring boards made of glass-cloth reinforced resin of FR-4-grade have a larger coefficient of linear expansion in the X-and Y-directions than chips and also the wiring boards made of glass-cloth reinforced resins have a high modulus of elasticity. Hence, the heat stress at the time of heat cycling, produced in packaging structure of packaging substrates, is so large as to cause a lowering of connection reliability of the packaging structure. There has been such a problem.
There has been another problem that, since a glass cloth is used as a reinforcing material, the surface of electrodes formed on the surface of the wiring board undulates periodically and hence the electrodes have uneven height to have a low connection reliability.
DISCLOSURE OF THE INVENTION
The present invention was made taking account of the above problems when electronic component parts such as semiconductor chips are electrically interconnected to a packaging substrate by mechanical electrode connection through an adhesive such as an anisotropic conductive adhesive having conductive particles dispersed therein, and provides an electronic component part device such as a semiconductor device in which semiconductor chips can be connected to a packaging substrate of multi-layer wiring board and which has a superior long-term connection reliability.
The present invention is an electronic component part device having a packaging substrate and at least one electronic component part mounted on the packaging substrate;
the electronic component part has a connecting electrode on the side coming into contact with the packaging substrate;
the packaging substrate has, on its surface, a connecting electrode terminal corresponding to the connecting electrodes of the electronic component part to be mounted; and
the electronic component part being so provided that it is mounted on the connecting electrode terminal at the mounting position on the surface of the packaging substrate, with its own connecting electrode correspondingly to the connecting electrode terminal, the face of the electronic component part on which the connecting electrode have been formed and the surface of the packaging substrate are fastened by bonding through an adhesive, and the connecting electrode terminal of the substrate and the connecting electrode of the electronic component part are electrically interconnected; wherein;
the packaging substrate comprises;
a plurality of insulating layers;
a plurality of wiring layers provided between the insulating layers; and
a conductor provided in such a way that it passes through at least one constituent layer of the insulating layers, in order to electrically interconnect predetermined layers among the wiring layers;
the plurality of insulating layers having;
at least one first insulating layer containing a resin reinforced with a glass base material; and
as an outermost layer, a second insulating layer which constitutes one layer at least on the side where the electronic component part is fastened by bonding;
the first insulating layer having a storage elastic modulus represented by E
1
, as measured by the DVE method, and the second insulating layer having a storage elastic modulus represented by E
2
, as measured by the DVE method, which are;
E
2
=0.01E
1
to 0.5E
1
.
The above storage elastic modulus can be measured with, e.g., RHEOSPECTRA DVE-4, manufactured by Rheology Co., Ltd. (tension mode; frequency: 10 Hz; temperature rise: 5° C./min; measured at from −40° C. up to 250° C.). The storage elastic moduli E
1
and E
2
are compared as values at the same temperature not higher than glass transition temperature Tg.
The present invention makes it possible to obtain an electronic component part such as a semiconductor device, promising a superior connection reliability between electronic component parts such as semiconductor chips, and a packaging substrate.
REFERENCES:
patent: 5350621 (1994-09-01), Yuhas et al.
patent: 5844320 (1998-12-01), Ono et al.
patent: 6002180 (1999-12-01), Akram et al.
patent: 6090468 (2000-07-01), Shimada et al.
patent: 6121289 (2000-09-01), Capote et al.
patent: 7-231050 (1995-08-01), None
patent: 8-124965 (1996-05-01), None
Inada Teiichi
Kojima Kazuyoshi
Nagai Akira
Nakaso Akishi
Shimada Yasushi
Hitachi Chemical Company Ltd.
Parekh Nitin
Pennie & Edmonds LLP
Thomas Tom
LandOfFree
Electronic component parts device does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Electronic component parts device, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Electronic component parts device will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-2586481