Electronic component package and method of manufacturing same

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material

Reexamination Certificate

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Details

C257S710000

Reexamination Certificate

active

06849939

ABSTRACT:
An electronic component package includes a case having a cavity portion including an electronic component therein, and a lid member which is fusion-welded to the case via a fusion-welding layer to hermetically seal the cavity portion. The case has a first metal layer laminated on the case so as to be exposed on the open side at the cavity portion. The lid member has a core portion, and a second metal layer laminated on a side of the core portion facing the case. The fusion-welding layer has a soldering material layer formed of a soldering material, and first and second intermetallic compound layers disposed on opposite sides of the soldering material layer as a result of diffusion of a major component of the soldering material into the first metal layer and the second metal layer. The ratio of the area of the first and second intermetallic compound layers in a longitudinal section of the fusion-welding layer relative to the area of the longitudinal section of the fusion-welding layer is in a range of from about 25% to about 98%. This package maintains superior airtightness even when exposed to a high-temperature atmosphere, which is higher than the melting point of the soldering material.

REFERENCES:
patent: 5909056 (1999-06-01), Mertol
patent: 20030104651 (2003-06-01), Kim et al.
patent: 10-135523 (1998-05-01), None
patent: 2000-058687 (2000-02-01), None
patent: 2000-106408 (2000-04-01), None
patent: 2000-164746 (2000-06-01), None
patent: 2000-223606 (2000-08-01), None
patent: 2000-277940 (2000-10-01), None
patent: 2001-077528 (2001-03-01), None
patent: 2001-274539 (2001-10-01), None

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