4. Electrical generator or motor structure
  5. Non-dynamoelectric
  6. Piezoelectric elements and devices

Yoshikiyo Ogasawara

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Electronic component package and method of manufacturing same

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Including adhesive bonding step
Reexamination Certificate

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Electronic component package and method of manufacturing same

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material
Reexamination Certificate

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Quartz oscillator device

Electrical generator or motor structure – Non-dynamoelectric – Piezoelectric elements and devices
Reexamination Certificate

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Profile ID: LFUS-PAI-P-2715007

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