Electronic component mounting method and apparatus and...

Details Electronic component mounting method and apparatus and... Electronic component mounting method and apparatus and...

2007-06-12

2007-06-12

Geyer, Scott B. (Department: 2812)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

With vibration step

C257SE21518

Reexamination Certificate

active

10508460

ABSTRACT:
A component mounting apparatus includes a component feeder (20) that feeds a component (2) with its bump electrodes facing down, a mounting head (5) that mounts the component onto a substrate (3), a supporting base (8) that secures the substrate, and a positioning device (6, 7) that aligns the component with the substrate. The mounting head includes an ultrasonic vibration generator (24), an ultrasonic vibration propagation member (34, 38, 54) that conveys the ultrasonic vibration provided by the ultrasonic vibration generator to a working face (33, 41, 57) holding the component as vibration parallel thereto, a pressure loader (22, 23, 39, 55, 59) that applies a pressure load to the working face from a position immediately thereabove in the direction perpendicular thereto, and a heater (32, 47, 49, 50, 51, 52, 53) that heats the vicinity of the working face. Thereby, ultrasonic bonding is carried out with high reliability even if the component has a number of bump electrodes (2a) on its face.

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patent: 2000-68327 / (2000-03-01), None

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