Metal working – Method of mechanical manufacture – Electrical device making
Reexamination Certificate
2011-04-12
2011-04-12
Arbes, C. J (Department: 3729)
Metal working
Method of mechanical manufacture
Electrical device making
C029S830000, C029S840000, C438S108000
Reexamination Certificate
active
07921551
ABSTRACT:
An electronic component mounting method includes a step of applying a resin composition (3) including solder powder, convective additive and resin having fluidity at the melting temperature of the solder powder on a main surface of a wiring substrate (1) provided with conductive wirings and connecting terminals, a step of preparing a group of electronic components consisting of a plurality of electronic components (7, 8and9) including at least a passive component, the respective electronic components comprising electrode terminals, position-aligning connecting terminals with the electrode terminals, and making the group of electronic components abut a surface of the resin composition, a step of heating at least the resin composition so as to melt solder powder and make the solder powder self-assembled between the connecting terminals and the electrode terminals by the convective additive, and thereby connecting the connecting terminals and the electrode terminals by soldering, and a step of fixedly adhering the group of electronic components to the wiring substrate using the resin by hardening the resin in the resin composition. Accordingly, a mounting process can be remarkably simplified without forming bumps in advance.
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Karashima Seiji
Kitae Takashi
Kojima Toshiyuki
Komatsu Shingo
Nakatani Seiichi
Arbes C. J
McDermott Will & Emery LLP
Panasonic Corporation
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