Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Bump leads
Reexamination Certificate
2007-01-23
2007-01-23
Clark, Jasmine (Department: 2815)
Active solid-state devices (e.g., transistors, solid-state diode
Combined with electrical contact or lead
Bump leads
C257S737000, C257S780000, C257S781000, C257SE23020, C257SE23021
Reexamination Certificate
active
11103412
ABSTRACT:
An electronic component electrically connected to a counter substrate through a pad on an active surface, characterized in that a resin bump on the active surface and an electrically conductive film on the resin bump constitute a bump electrode, and that a plurality of bump electrodes are electrically connected to the one pad.
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Communication from European Patent Office regarding related application.
Saito Atsushi
Tanaka Shuichi
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