Electronic component lid that provides improved thermal dissipat

Details Electronic component lid that provides improved thermal dissipat Electronic component lid that provides improved thermal dissipat

1997-11-05

1999-08-03

Thompson, Gregory

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

165 802, 165 805, 174 152, 257715, H05K 720

Patent

active

059333235

ABSTRACT:
A lid that provides thermal dissipation for an integrated circuit. The lid is designed to be fastened to a printed circuit board and includes a casing having thermally conductive upper and lower plates. Between the upper and lower plates, inside the casing, is a hollow interior region within which vaporizing fluid and two or more segments of wick reside.

REFERENCES:
patent: 4118756 (1978-10-01), Nelson et al.
patent: 5095404 (1992-03-01), Chao
patent: 5409055 (1995-04-01), Tanaka et al.
patent: 5465782 (1995-11-01), Sun et al.
patent: 5694295 (1997-12-01), Mochizuki et al.
IBM Tech Discl. Bulletin, Patch et al, "Conduction Cooled Heat Plate For Modular Circuit Package", vol. 13, No. 2, Jul. 1970, p. 442.

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