Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Patent
1993-09-29
1995-01-10
Picard, Leo P.
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
2281791, 2281801, 22818021, 22818022, 257700, 257778, 257779, 361760, 361768, 361772, 361773, 361774, 361777, 361808, 437209, H05K 710, H05K 702
Patent
active
053813073
ABSTRACT:
A mounting pad arrangement (FIG. 5) improves reliability of placement of a surface mount component. A first pad array is disposed throughout an area on the surface (308) of a substrate (202), the area having four outside corners. The first pad array includes contact pads (502) arranged in a first linear grid pattern, and eight aligning pads (504,506,510,514,518), larger than the contact pads (502). Two aligning pads (504,506,510,514,518) are near each of the four outside corners. Each aligning pad (504,506,510,514,518) is positioned off center with respect to the first linear grid pattern such that a tangential line (608,610,612,614) can be drawn between an innermost point of the aligning pad (504,506,510,514,518) and corresponding innermost points of the contact pads (502) that are collinear on the first linear grid pattern. A second pad array (406) is disposed on the surface mount component and arranged in a second linear grid pattern that aligns with the first linear grid pattern. Eight pads of the second pad array (406) also align with points of intersection of the first linear grid pattern that fall within each of the eight aligning pads (504,506,510,514,518). Each pad of the second pad array (406) is equal in size to any other pad of the second pad array (406). Solder (312) is disposed between and contacting each pad of the first and second pad arrays.
REFERENCES:
patent: 3871014 (1975-03-01), King et al.
patent: 4032058 (1977-06-01), Riseman
patent: 4164778 (1979-08-01), Sawairi et al.
patent: 4600970 (1986-07-01), Bauer
patent: 4831724 (1989-05-01), Elliott
patent: 4949148 (1990-08-01), Bartelink
patent: 5019673 (1991-05-01), Juskey et al.
patent: 5022580 (1991-06-01), Pedder
IBM Technical Disclosure Bulletin "Method of Preparation of Controlled Chip Joining" by Bakos et al. vol. 21 No. 9 Feb. 1979.
"BGAs Face Production Testing, New Package Offers Promise but Must Clear Technology Hurdles", by Dave Hattas, Advanced Packaging, Summer 1993, pp. 44 to 46.
"IBM Details Its Ball-Grid Array Push", by Terry Costlow, Electronic Engineering Times, Issue 758, Aug. 9, 1993, pp. 1 and 8.
"SMT, COB and TAB, What to Expect in Design Tradeoffs", by Elliott H. Newcombe, III, Surface Mount Technology, Aug. 1993, pp. 38 to 41.
"IBM and Compaq Endorse BGAs, Update No. 2: Future of Fine Pitch in Doubt", Manufacturing Market Insider, Jul. 1993, pp. 1 to 4.
"Arrayed Against Fine Pitch", Circuits Assembly, p. 22, Feb. 1992.
Hertz Allen D.
Thompson Kenneth R.
Tribbey David A.
Breeden R. Louis
Floam D. Andrew
Motorola Inc.
Picard Leo P.
Sparks Donald A.
LandOfFree
Self-aligning electrical contact array does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Self-aligning electrical contact array, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Self-aligning electrical contact array will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-855273