Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
Reexamination Certificate
2007-02-13
2007-02-13
Estrada, Michelle (Department: 2823)
Semiconductor device manufacturing: process
Coating with electrically or thermally conductive material
To form ohmic contact to semiconductive material
C257S778000, C257SE21575, C438S584000, C438S614000, C438S617000, C438S524000, C438S666000
Reexamination Certificate
active
10960994
ABSTRACT:
An electronic component has a semiconductor chip and microscopically small flip-chip contacts belonging to a rewiring plate, on which macroscopically large elastic external contacts are arranged. The rewiring plate has a wiring support made of polycrystalline silicon, amorphous glass, or metal. Furthermore, the present invention relates to a method for the production of a suitable wiring support and of the electronic component.
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Meyer-Berg Georg
Vasquez Barbara
Edell Shapiro & Finnan LLC
Estrada Michelle
Stark Jarrett J.
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