Electronic component having an interconnect substrate adjacent t

Active solid-state devices (e.g. – transistors – solid-state diode – Responsive to non-electrical signal – Physical deformation

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257419, 257418, 257420, H01L 2982

Patent

active

057478589

ABSTRACT:
An electronic component includes a substrate (11) having a device surface (13) and opposite ends (14, 15) adjacent to the device surface (13), an electronic device (16) supported by the device surface (13), and an interconnect substrate (30) overlying a first end (14) of the substrate (11) and electrically coupled to the electronic device (16). The electronic component can be manufactured by inserting the second end (15) of the substrate (11) into one of a plurality of holes (23) in a carrier (20) wherein the device surface (13) and the carrier (20) form an angle greater than approximately five degrees.

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patent: 5352851 (1994-10-01), Wallace et al.
patent: 5604377 (1997-02-01), Palagonia

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