Electronic component device and manufacturing method therefor

Details Electronic component device and manufacturing method therefor Electronic component device and manufacturing method therefor

2005-08-23

2005-08-23

Clark, Jasmine (Department: 2815)

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Ball or nail head type contact, lead, or bond

C257S781000, C257S784000, C257S775000, C257S778000

Reexamination Certificate

active

06933615

ABSTRACT:
In an electronic component device, electrodes of an electric component and respective wiring lines on a board are collectively bonded together via bumps using ultrasonic vibration. The wiring lines include wiring lines that are substantially parallel to the direction of ultrasonic vibration and wiring lines that are substantially perpendicularly to the direction of ultrasonic vibration. A displacement inhibiting layer is provided inside the board in a portion below the wiring lines that are substantially perpendicular to the direction of ultrasonic vibration.

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