Electronic component and method of manufacture

Details Electronic component and method of manufacture Electronic component and method of manufacture

1998-03-02

2000-11-14

Clark, Sheila V.

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Of specified configuration

257773, 257774, H01L 2348

Patent

active

06147410&

ABSTRACT:
An electronic component includes a semiconductor substrate (101, 301, 401), an electrically conductive layer (102, 103, 302, 303, 402, 403) supported by the semiconductor substrate (101, 301, 401), and a lead (110, 120, 210, 310, 410, 420) having an electrical coupling portion (112, 122, 212, 312, 412, 422) coupled to and supported by the electrically conductive layer (102, 103, 302, 303, 402, 403) wherein the electrical coupling portion (112, 122, 212, 312, 412, 422) has at least one notch (115, 215, 315) adjacent to the electrically conductive layer (102, 103, 302, 303, 402, 403).

REFERENCES:
patent: 3061766 (1962-10-01), Kelley
patent: 3153750 (1964-10-01), Ackerman
patent: 5110761 (1992-05-01), Kalfus et al.
patent: 5218231 (1993-06-01), Kudo
patent: 5665996 (1997-09-01), Williams et al.
patent: 5894170 (1999-04-01), Ishikawa

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