Electronic component and method of manufacture

Details Electronic component and method of manufacture Electronic component and method of manufacture

1998-04-03

1999-05-11

Saadat, Mahshid

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

With contact or lead

257773, 257698, 174 524, H01L23/053;23/48;23/52

Patent

active

059030518

ABSTRACT:
An electronic component can be more easily tested after being mounted onto a circuit board (660). The component also stops cracks from propagating over vital areas of a substrate (110). The component includes an electrically insulative substrate (100), electrically conductive traces (120) supported by the electrically insulative substrate (100), and an electrically insulative layer (310) covering inner and outer portions of the electrically conductive traces (120) while middle portions of the electrically conductive traces (120) remain exposed.

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