Electronic component and method for its production

Details Electronic component and method for its production Electronic component and method for its production

2009-05-04

2011-11-01

Lebentritt, Michael (Department: 2829)

Active solid-state devices (e.g., transistors, solid-state diode

With shielding

C257S697000, C257S700000, C257S723000, C257SE21518, C257SE23006, C257SE23176, C257SE23181, C257SE23192, C257SE25016

Reexamination Certificate

active

08049311

ABSTRACT:
An electronic component includes a number of leads and at least one cooling element. The bottom surface of the cooling element is exposed and the material of the cooling element is different from the material of the leads. At least one semiconductor chip is provided on the cooling element. An encapsulation compound covers at least part of the leads, at least part of the semiconductor chip(s), and at least part of the cooling element(s).

REFERENCES:
patent: 4835598 (1989-05-01), Higuchi et al.
patent: 4905075 (1990-02-01), Temple et al.
patent: 4918511 (1990-04-01), Brown
patent: 5202288 (1993-04-01), Doering et al.
patent: 5208188 (1993-05-01), Newman
patent: 5409866 (1995-04-01), Sato et al.
patent: 5497033 (1996-03-01), Fillion et al.
patent: 5498902 (1996-03-01), Hara
patent: 5604978 (1997-02-01), Sherif et al.
patent: 5646828 (1997-07-01), Degani et al.
patent: 5681777 (1997-10-01), Lynch et al.
patent: 5889654 (1999-03-01), Pierson et al.
patent: 6001671 (1999-12-01), Fjelstad
patent: 6020597 (2000-02-01), Kwak
patent: 6039471 (2000-03-01), Wyland
patent: 6072228 (2000-06-01), Hinkle et al.
patent: 6104089 (2000-08-01), Akram
patent: 6166430 (2000-12-01), Yamaguchi
patent: 6229216 (2001-05-01), Ma et al.
patent: 6239487 (2001-05-01), Park et al.
patent: 6246115 (2001-06-01), Tang et al.
patent: 6309915 (2001-10-01), Distefano
patent: 6396130 (2002-05-01), Crowley et al.
patent: 6455936 (2002-09-01), Lo et al.
patent: 6501160 (2002-12-01), Higuchi et al.
patent: 6501164 (2002-12-01), Chen et al.
patent: 6590281 (2003-07-01), Wu et al.
patent: 6707149 (2004-03-01), Smith
patent: 6709895 (2004-03-01), Distefano
patent: 7145225 (2006-12-01), Lee
patent: 7205674 (2007-04-01), Huang et al.
patent: 7443019 (2008-10-01), Bauer et al.
patent: 7508066 (2009-03-01), Huang et al.
patent: 7683477 (2010-03-01), Otremba
patent: 7763963 (2010-07-01), Hong
patent: 7851906 (2010-12-01), Alcoe et al.
patent: 2001/0005044 (2001-06-01), Fjelstad
patent: 2002/0066954 (2002-06-01), Huang et al.
patent: 2004/0029312 (2004-02-01), Knapp et al.
patent: 2004/0094829 (2004-05-01), Minamio et al.
patent: 2004/0183188 (2004-09-01), Oohama
patent: 2005/0133824 (2005-06-01), Hosokawa et al.
patent: 2005/0173793 (2005-08-01), Rohrmoser et al.
patent: 2005223005 (2005-08-01), None
patent: 2005223005 (2005-08-01), None
patent: 2006223005 (2006-08-01), None
patent: 2001058577 (2001-07-01), None
patent: 0193327 (2001-12-01), None

Affiliated with

Also associated with

Rating

Electronic component and method for its production does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Electronic component and method for its production, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Electronic component and method for its production will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-4267402