Electronic component and electronic configuration

Details Electronic component and electronic configuration Electronic component and electronic configuration

2007-02-27

2007-02-27

Clark, Jasmine (Department: 2815)

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Of specified material other than unalloyed aluminum

C257S779000, C257S778000, C257SE23021, C257SE23023

Reexamination Certificate

active

11115401

ABSTRACT:
An electronic component includes a substrate with outer contact areas comprising copper. Lead-free solder bumps are disposed on the outer contact areas of the electronic component. An electronic configuration includes an electronic component and a printed circuit board. The electronic component is mounted on the printed circuit board by lead-free solder electrical connections.

REFERENCES:
patent: 6075710 (2000-06-01), Lau
patent: 6469393 (2002-10-01), Oya
patent: 6696757 (2004-02-01), Yunus et al.
patent: 2003/0186072 (2003-10-01), Soga et al.
patent: 2006/0014309 (2006-01-01), Sachdev et al.
patent: 60-154632 (1985-08-01), None
patent: 2000-101014 (2000-04-01), None
patent: 2002239780 (2002-08-01), None

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