Electronic circuit device and method of producing the same

Details Electronic circuit device and method of producing the same Electronic circuit device and method of producing the same

1985-10-04

1987-06-16

Grimley, Arthur T.

Electricity: conductors and insulators

Boxes and housings

Hermetic sealed envelope type

29840, 2281802, 228185, 357 67, H01L 2314

Patent

active

046737723

ABSTRACT:
In connecting an electronic circuit part such as a semiconductor or other part to a substrate for mounting the part with solder, the solder is composed of a high-melting-point solder portion which is subjected to working such as rolling and heat treatment in order to break the cast structure thereof, and a smaller volume of low-melting-point solder portions. The high-melting-point solder portion is connected to both the electronic circuit substrate and the electronic circuit part through the low-point-melting solder portions.
This method enables interconnection between objects to be connected without impairing the high ductility and toughness of the high-melting-point solder which is subjected to working and heat treatment. This soldering method ensures highly reliable manufacture of miniaturized high density circuits, such as LSI.

REFERENCES:
patent: 3871014 (1975-03-01), King et al.
patent: 3871015 (1975-03-01), Lin et al.
patent: 4604644 (1986-08-01), Beckham et al.

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