Electronic circuit device and method for manufacturing same

Details Electronic circuit device and method for manufacturing same Electronic circuit device and method for manufacturing same

2011-03-22

2011-03-22

Clark, S. V (Department: 2823)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Encapsulating

C438S126000

Reexamination Certificate

active

07910406

ABSTRACT:
An electronic circuit device includes at least one semiconductor element, a plurality of external connection terminals, connecting conductors electrically connecting the semiconductor element and external connection terminals, and an insulating resin covering the semiconductor element and supporting the connecting conductors integrally. The semiconductor element is buried in the insulating resin, and terminal surfaces of the external connection terminals are exposed from the insulating resin.

REFERENCES:
patent: 6861288 (2005-03-01), Shim et al.
patent: 7521297 (2009-04-01), Lee et al.
patent: 2005/0168960 (2005-08-01), Asahi et al.
patent: 5-114693 (1993-05-01), None
patent: 7-321139 (1995-12-01), None
patent: 2001-077268 (2001-03-01), None
patent: 2001-217338 (2001-08-01), None
patent: 2001-345415 (2001-12-01), None
patent: 2005-244211 (2005-09-01), None
patent: 2005-294443 (2005-10-01), None
International Search Report issued Dec. 19, 2006 in the International (PCT) Application of which the present application is the U.S. National Stage.
Partial English translation of JP 2005-294443A, Oct. 2005, which was cited in the IDS filed Mar. 12, 2008.
Partial English translation of JP5-114693A, May 1993, which was cited in the IDS filed Mar. 12, 2008.

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